Genesys Electronic Components on ICGOODFIND SiteMap
最新文章
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- TSMC to Raise Foundry Prices Up to 25% in 2027 – HPC Orders Face Premium
- ASML High-NA EUV Components Arrive in Albany – U.S. R&D Gets Next-Gen Lithography Boost
- Kyocera CEO: Semiconductor Parts Boom to Last Until 2030 – Ceramic & MLCC Capacity Ramping
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- TFME H1 Profit Soars Up to 337% – AI & Storage Demand Fuel Packaging Boom
- World’s First 8-Inch 2D Semiconductor Pilot Line Goes Live in Shanghai
- Samsung Tapes Out Tesla AI5 Chip on 2nm at Taylor Fab – Mass Production Set for 2027
- Silex Buys ON Semi’s 200mm U.S. Fab for $40M – MEMS Capacity Play
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- onsemi M74VHC1GT14DFT1G Single Schmitt-Trigger Inverter Overview
- onsemi MUR3020WTG: Ultrafast Recovery Rectifier for High-Efficiency Power Conversion
- onsemi RB751S40T1G Schottky Barrier Diode: Key Features and Applications
- onsemi MBRA160T3G Schottky Barrier Rectifier: Key Specifications and Application Advantages
- onsemi NC7WZ16P6X: Ultra-Miniature Dual Buffer Gate for Space-Constrained Applications
- MC33078DR2G: A High-Performance, Low-Noise Dual Operational Amplifier from onsemi
- Onsemi BVSS123LT1G: High-Performance N-Channel Logic Level Enhancement Mode Field Effect Transistor
- Designing High-Performance Flyback Converters with the onsemi UC2845BD1R2G Current Mode PWM Controller
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Yongxi Electronics Bets $1.4B on Advanced IC Packaging Megaproject – Will 8-Year Payoff Justify the Gamble?
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- Nearfield Instruments Raises $380M Series D – Largest Dutch Deep‑Tech Round Ever
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- WinCO Nova 1000mW Single‑Mode 980nm Pump Laser Chip Breaks Global Monopoly
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Nokia Expands Pennsylvania Photonics Plant to Power AI Interconnect, Adds 250 Jobs
- Qualcomm in Talks to Acquire AI Chip Startup Tenstorrent for Up to $10 Billion
- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP LPC2131FBD64/01-S: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2134FBD64/01,11: A Deep Dive into the ARM7-Based Microcontroller
- LPC1837JET100: NXP's High-Performance ARM Cortex-M3 Microcontroller for Advanced Embedded Applications
- LPC2119FBD64/01: A 15 MHz ARM7TDMI-S Microcontroller for Embedded Control Applications
- The NXP LPC1857JET256: A High-Performance ARM Cortex-M3 Microcontroller for Advanced Embedded Applications
- NXP LPC2104FBD48/01,15: A Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2103FBD48-S: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP LPC2102FHN48: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- NXP BZX84C Series: Key Specifications and Application Circuits for Circuit Protection and Voltage Regulation
- LPC54606J256ET180E: NXP's High-Performance ARM Cortex-M4 Microcontroller for Embedded Systems
- FX32K146UAT0VLLT: NXP's Ultra-Low-Power ARM Cortex-M3 MCU for Automotive and Industrial Applications
- NXP CBT3251PW: A High-Performance 1-of-8 FET Multiplexer/Demultiplexer for Bus Switching Applications
- NXP FX32K144HAT0MLLR: A Comprehensive Technical Overview of the 32-bit Automotive Microcontroller
- NXP CLRC63201T/0FE,112: A Comprehensive Technical Overview of the Contactless Reader IC
- NXP MFRC52202: A Comprehensive Guide to the Advanced Contactless Reader IC
- NXP BZT52H-C4V7 Zener Diode: Key Features, Applications, and Technical Specifications
- Huawei Kirin Chip Breaks 3GHz with Logic Folding, Unveils Tao Law at ISCAS 2026
- Alibaba Cloud Unveils Zhenwu M890 AI Chip and 128‑Card Supernode Server
- AMD’s Su Meets China VP He Lifeng, Pledges More Investment and Compute Partnership
- ChangXin Memory Q1 Profit Hits 4.6 B , R e v e n u e S u r g e s 719 4.6B,RevenueSurges7197.1B
- NXP 74LVC07APW: A Comprehensive Technical Overview of the Hex Buffer with Open-Drain Outputs
- NXP PMEG2010ER115: A High-Performance Schottky Barrier Rectifier for Modern Power Applications
- HuaHong Q1 Profit Soars 458% to $20.9M, 12-Inch Revenue Hits 62.7%
- NXP PMD9003D: A High-Performance Power Management IC for Advanced Automotive and Industrial Applications
- NXP TDA8922CTH/N1,118: A Comprehensive Technical Overview of the 2x 50W Class-D Audio Amplifier
- NXP TEA1791T/N1: A Highly Integrated Synchronous Rectification Controller for Efficient SMPS Designs
- NXP 74LVC1G32GW: A Single Gate OR Logic IC for Space-Constrained Designs
- NXP PUMH9: A High-Performance RF Transistor for Next-Generation Wireless Applications
- NXP TDF8599BTH/N1C: A High-Performance 4 x 80 W Class D Power Amplifier for Advanced Automotive Audio Systems
- AMD Quietly Takes Stake in Marvell as Nvidia Commits $2B to Strategic Partnership
- US Pressures Tesla to Move AI6.5 Chip Orders from TSMC to Intel
- NXP LPC2103FBD48,118: A Comprehensive Technical Overview of the ARM7-Based Microcontroller
- NXP MK22FX512AVLK12: A Comprehensive Technical Overview of Kinetis K22 Microcontrollers
- NXP 74HCT174PW: A Comprehensive Technical Overview of the Hex D-Type Flip-Flop IC with Edge-Triggered Reset
- NXP LS1023ASE7QQB: A High-Performance Embedded Processor for Advanced Networking Applications
- Unveiling the NXP FS32K144HRT0MLHR: A 32-bit Automotive Microcontroller for Safety-Critical Applications
- The NXP P87C51RD2BA: An In-Depth Technical Overview of the Enhanced 8-bit Microcontroller
- NXP LPC2129FBD64/01,15: A 15 MHz ARM7TDMI-S Microcontroller for Embedded Control Applications
- NXP P3041NXN7MMC: A Comprehensive Technical Overview of QorIQ's Advanced Processor
- TSMC Arizona’s Third Fab Tops Out, Set for 2nm Production
- Arrow Electronics Q1 Revenue Jumps 39% to $9.47B, Beats Wall Street Estimates
- Astera Labs Unveils 320‑Lane PCIe Switch – Industry’s Largest
- Lattice Buys Firmware Giant AMI for $1.65B – Aiming at AI Data Centers
- NXP TEA19161T/2Y: A High-Performance Resonant Controller for Efficient Power Supply Designs
- LPC1114FBD48/302EL: A Comprehensive Technical Overview of NXP's ARM Cortex-M0 Microcontroller
- NXP MPX2050DP: A Comprehensive Technical Overview of the Integrated Pressure Sensor
- NXP SA614AD: A Comprehensive Technical Overview of the Low-Power FM IF System
- NXP BFT92W,115: A Comprehensive Technical Overview of the PNP Silicon RF Transistor
- Unlocking High-Performance NFC and RFID Applications with the NXP PN5180A0HN/C2 Multi-Protocol Frontend IC
- NXP TJF1052IT/2Y: A Comprehensive Technical Overview of the High-Speed CAN Transceiver
- NXP BT151-600R: A Comprehensive Technical Overview of the 600V Standard SCR Thyristor
- GalaxyCore Ships 1.1B CMOS Sensors – Revenue Up 22% But Profit Crashes 73%
- CRM IC’s 2025 Revenue Tops $1.5B – High‑End MEMS Microphone Breakthrough
- Secure Serial EEPROM Integration with Microchip 25AA256-E/SM
- Microchip 25AA160-I/SN 16Kb SPI Bus Serial EEPROM: Features and Applications
- Microchip 25AA256T-E/SM 256K SPI Bus Serial EEPROM: Features and Applications
- Microchip 25AA256T-E/ST 256K SPI Bus Serial EEPROM with High-Speed Clock Support